IL-AG9 Board-to-Board

Description

JAE IL-AG9 board-to-board connectors with 0.4mm pitch for high-density PCB stacking. AEC-Q200 qualified automotive grade. Used in ADAS camera modules, radar processors, and automotive MCU boards. Available in 1.0mm and 1.5mm stacking heights.

Technical Specifications

Pin/Contact Count

10–100

Rated Voltage

50V

IP Rating

IP20

Temperature Range

-55 to +125°C

Shell Material

LCP

Mating Cycles

30 cycles

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