Description
High-speed board-to-board connector supporting 112 Gbps PAM4 per differential pair (up to 25+ Gbps NRZ). Wafer-based system with optional shielding for channel isolation. Used in 400G/800G data center switches and high-performance computing line cards.
Technical Specifications
- Pin/Contact Count
- 4–160
- Rated Voltage
- 50V
- IP Rating
- IP20
- Temperature Range
- -40 to +85°C
- Shell Material
- LCP
- Mating Cycles
- 250 cycles
IP RatingIP20
IP20IP40IP54IP65IP68
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